Ion Sources
Fast Atom Sources
High-performance fast atom beam sources designed for surface cleaning, etching, and modification. Delivers neutral atom beams with controlled energy for precise material processing without surface charging effects.
Key Features:
- •Neutral atom beam generation
- •Adjustable beam energy
- •Wide coverage area
- •Minimal surface damage
- •UHV compatible operation
Applications:
Applications include substrate pre-cleaning for significantly enhanced film adhesion, FAB bonding, sputter etching and atom beam sputter deposition with inert gases such as Ar or Xe.
Key Features:
- •High vacuum and UHV compatible
- •Simple operation and construction for reliability
- •Reactive gas compatibility
- •No filaments to burn-out
- •Versatile compact design for easy retrofitting
- •Charge-free atomic beams without neutralisers
Also reactive gases such as CF₄, SF₆, C₂F₆, C₃F₈, CHF₃, I₂, etc, are used for milling semiconductor materials at improved rate and high selectivity.
With non-inert gases, the beam from the Saddle Field fast atom source may be molecular or contain radicals, but still largely remains uncharged.
Mini Ion Sources
Compact ion beam sources ideal for sputtering, surface analysis, and thin film modification. Designed for easy integration into existing UHV systems with minimal space requirements while maintaining high performance.
Key Features:
- •Compact footprint design
- •High ion current density
- •Precise beam control
- •Multiple gas compatibility
- •Long operational lifetime
DC Ion Source
Reliable direct current ion sources for continuous operation in demanding applications. Perfect for sputtering, ion beam assisted deposition, and surface modification with excellent stability and reproducibility.
Key Features:
- •Continuous DC operation
- •Stable ion current output
- •Easy gas switching
- •Water-cooled cathode
- •Low maintenance design
RF Ion Source
Radio frequency ion sources providing versatile operation with both reactive and inert gases. Ideal for applications requiring high ion density and excellent uniformity across large substrate areas.
Key Features:
- •RF plasma generation
- •High ion density output
- •Excellent uniformity
- •Reactive gas compatible
- •Automated control options
Need More Information?
Our technical team is ready to discuss your specific requirements and help you choose the right solution.