We are now bringing DC and RF ion sources back to our product line.
Production of these was withdrawn due to component supply chain problems for the power supplies.
As there are now many manufacturers of stand alone power supplies we now offer these high performance sources without power supplies:
These are in addition to the range of extremely rugged and versatile FAB (Fast Atom) sources we have made for many years!
Applications include substrate pre-cleaning for significantly enhanced film adhesion, FAB bonding, sputter etching and atom beam sputter deposition with inert gases such as Ar or Xe.
High vacuum and UHV compatible.
Simple operation. Simple construction for reliability and easy maintenance.
Reactive gas compatibility. Construction materials compatible with many reactive gases.
No filaments to burn-out.
Versatility. The compact design allows them to be easily retrofitted to many types of vacuum system.
Charge free. FAB sources provide charge-free atomic beams without filaments or neutralisers.
Also reactive gases such as CF4, SF6, C2F6, C3F8, CHF3, I2, etc, are used for milling semiconductor materials at improved rate and high selectivity. With non-inert gases, the beam from the Saddle Field fast atom source may be molecular or contain radicals, but still largely remains uncharged.
